SPILL SEMICONDUCTOR and the like.

  

  

  

  We will build molds in the U.S. That Weer Shipped to Asia to Run Parts. As Asia Started Advancing and Making its Own Molds, The Semiconductor Industry in the U.S. Fell Apart

  AS Manual Wire Bonders, Automation Equipment and Pick-And-Place Machines) for Electronics Manufacturers that Span a Very Broad Customer Base.

  Then, then

  Fast Forward to 2013, and we launch into propuction thermost molding services. TODAY, we have first molding presents. NDC Internal Operational ONERENE ROOF WITH NEU Dynamics.

  

  Being exposed to the epoxy molding compound.

  applications.

  for a Successful Production System.

  

  the parting line. The large mold was about 19 x 24 Inches.

  Cavity but not flash. When a thermoset material hardness, it is extremely hard.

  Sweep, The Material is pushed into the mold cavities with a very slow and geentle process.

  

  Hartsoe: We are a 24-person team who gets to see a lot of first-off stuff. Our Sweet Spot is 600 to 1,000 parts a year. We do a lot of low-volume work.up to 250,000 PARTS. Electronics EncapSuration (or Putting Plastic Around Electronics) Makes up 65% of our work.

  We are in a unique position to take on work like this before we offer a solution & mdash; we have the mole

  The u.s. is scheduled to grow 29% a year, year over year, for the next 10 years.

  We Also Designed and Developed A Mold for An Automotive Customer for A Device that has Resulted in (8) 364 Cavity Molds. This device is an optional light sensor.

  

  

  

  

  

  We Offer Low-to Medium-Volume Contract Theermoset Molding and Our Full Transfer Molding Lab can handle a variety of molding processes and applications.

  

  

  

  vene manufacturing.